Inquiry
Ultra-thin / ultra-thick / specially processed wafer
・ As sliced product (at the specified thickness)
・ Ultra-thin finish (150 μm)
・ Ultra-thin finish (150 μm)
We provide high-precision wafers capable of accurate groove fabrication for sensors and MEMS applications that perform deep digging by etching.
Smaller plane orientation (cutting angle) tolerance, smaller OF position angle tolerance, smaller thickness tolerance, more accurate flatness High quality such as single-sided mirror wafers from 2 inches to 12 inches, wafers with oxide film, etc. Wafers are provided. Square wafers, OF (orientation flat) notched (round) wafers to meet customer needs. Double-sided mirror, double-sided etch, double-sided wrap, etc. can be finished. Wafer thickness can be manufactured from 100 μm (4 inches) to 2,000 μm. CZ / FZ crystal small diameter type ~ 12inch
Smaller plane orientation (cutting angle) tolerance, smaller OF position angle tolerance, smaller thickness tolerance, more accurate flatness High quality such as single-sided mirror wafers from 2 inches to 12 inches, wafers with oxide film, etc. Wafers are provided. Square wafers, OF (orientation flat) notched (round) wafers to meet customer needs. Double-sided mirror, double-sided etch, double-sided wrap, etc. can be finished. Wafer thickness can be manufactured from 100 μm (4 inches) to 2,000 μm. CZ / FZ crystal small diameter type ~ 12inch
Polishing the back surface of a silicon wafer (back grind)
| Material | Si silicon wafer |
| specification | 3 inches to 8 inches (consultation required depending on 12 inch specifications) |
| Features | Integrated back grind and polish processing with CMP equipment 12-inch wafers can be polished to a thickness of 50 μm or less. 3 inch or less and irregularly shaped wafers can also be supported. |
Metal film, oxide film, vapor deposition processing
| Material | GaAs wafer, silicon wafer |
| specification | 3, 4, 6 and 8 inch GaAs wafers |
| Thin film | Compatible with various metal films such as Au, Pt, Ti, etc. Silicon wafers up to 8 inches in size |
| quality | Quality Assurance with State-of-the-art Inspection Equipment Film Thickness Measuring Equipment |
| Features | Efficient processing is possible with integrated processing with polishing. Flexible response to customer’s recipes |
Silicon monitor dummy wafer processing
| Material | Silicon wafer |
| specification | 4, 5, 6, 8 and 12 inch wafer particles are 0.09 micron and 80 or less Heavy metal level clears 10 9 atom / cm2 |
| Features | Dummy, test wafer recycling, vacuum packaging (particle guaranteed) products, polished, and foamed cases are also available. |
